Ideal for the economical cleaning of electronic print circuit boards, surface mount technology (SMT) stencil cleaning, tool cleaning, and general surface wiping. IPA dissolves a wide range of polar and non-polar soils. It is often used to remove light oils, fingerprints, cutting fluids, flux residues, carbon deposits and mold release. It is also readily miscible in water, so can be used as a drying agent as well. At 70% IPA/30% DI water, a controlled evaporation allows soak time.