Soder-Wick offers the state of the art in desoldering technology. Soder-Wick is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.All wick is sealed in nitrogen-purged packaged to avoid corrosion and loss of performance from moisture and oxygen.The fastest, safest rosin flux desoldering braid packaged in static dissipative bobbins.
Applications:
Soder-Wick Rosin safely removes solder in all applications requiring Type ROL0 rosin flux.
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes.