Belden 3084A DeviceBus® for ODVA DeviceNet™, 2 Pair 22+24AWG (19x34+19x36) Tinned Copper, PVC+Foam PE Insulation, Individual Beldfoil® & OA Tinned Copper Braid(65%) Shield, PVC Outer Jacket, CMG, CL2. Suitable for harsh environment, ODVA device-level communication, used with CIP (common Industrial Protocol) for control, configuration, and data collection between devices, such as sensors and actuators, and higher level devices such as PLC, and PC in industrial automation, bus topology, etc.